JEDEC Solid State Technology Association

JEDEC®Universal Flash Storage (UFS) Standard Leverages MIPI M-PHY(R)

JEDEC® and MIPI have a complementary interest in the development of open standards for the mobile industry, and have collaborated on the incorporation of MIPI's M-PHY®and UniProSMspecifications as the physical layer of JEDEC's Universal Flash Storage (UFS) specification v1.1, published in June of 2012 and UFS v2.0, published in September, 2013.

To achieve the highest performance and most power efficient data transport, UFS uses the leading industry interface standards to form its Interconnect Layer: MIPI® Alliance’s M-PHY® and UniProSM  specifications. For more information on the specification, go to http://www.jedec.org/news/pressreleases/jedec-updates-universal-flash-storage-ufs-standard

For over 50 years, JEDEC has been the global leader in developing open standards and publications for the microelectronics industry. JEDEC committees provide industry leadership in developing standards for a broad range of technologies. Current areas of focus include 3D-ICs, Flash Memory, Mobile Memory, Main Memory (DDR3 SDRAM), Memory Module Design File Registrations, Memory Configurations, Quality & Reliability, and Mechanical Package Outlines.

For more information on JEDEC, please go to www.jedec.org

For more information on JEDEC Universal Flash Storage including access to the UFS specification, please visit: 
http://www.jedec.org/standards-documents/focus/flash/universal-flash-storage-ufs.

For access to the MIPI Specifications supporting UFS v2.0 please visit:
http://public.mipi.org/mipi-jedec/workspace/DocumentRequestWelcome

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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    Membership Model

    The MIPI Alliance has structured its membership categories to facilitate involvement from all companies in the mobile industry. The classes of membership in the MIPI Alliance are:

    Information on membership levels, privileges, and responsibilities are available in the Membership section.