Agreement Driven by Performance Needs of Mobile Device Market
Piscataway, NJ, and Hillsboro, OR May 3, 2011 – MIPI Alliance and the USB 3.0 Promoter Group today announced the signing of a letter agreement between the two organizations. The agreement will facilitate the combined use of the MIPI M-PHYSM physical layer with the SuperSpeed USB protocol and software layers to produce the SuperSpeed Inter-Chip (SSIC) specification. Currently under development, the specification will bring M-PHY’s exceptional high bandwidth and low power, and the significant performance enhancements of SuperSpeed USB “inside” the mobile device interface system. The two groups anticipate the SSIC specification will be available to USB adopters in early 2012.