MIPI Contributors and Board members met 24-28 March in Boston for Member Meeting North America #68, which welcomed 122 participants from 48 member companies for a full week of updates, planning and collaboration to advance MIPI specifications and the ecosystems they serve.
A post-meeting report that includes highlights of each group’s activities, updated development timelines and the latest MIPI Specification Roadmap will be distributed to all members later this month.
In addition to working group and joint sessions among more than a dozen MIPI groups, the meeting week also featured an Opening Plenary on 25 March, offering attendees the opportunity to hear directly from new board chair Hezi Saar and the chairs of the Technical Steering Group (TSG), M-PHY Working Group and UniPro Working Group.
Download the Opening Plenary presentation » (MIPI members only)
After welcoming attendees to the meeting, Peter Lefkin, MIPI executive director, took a moment to thank Sanjiv Desai, who stepped down as board chair late last year in conjunction with his retirement from Intel, for his many years of service to the Alliance. Lefkin went on to congratulate Hezi Saar (Synopsys, Inc.) on his new role, as well as new MIPI board officers Gaurav Arora (Google LLC), serving as vice chair, and Tom Schaeffer (Intel Corporation), serving as treasurer.
In his first Opening Plenary chair remarks, Saar discussed the role of MIPI specifications in emerging AI opportunities and industry innovation, noting that MIPI’s core strengths such as low power, low EMI and high performance are leading to new pathways. He went on to outline how MIPI can address these opportunities by focusing on its core strengths, deepening OEM engagement, leveraging member insights, exploring new frontiers and accelerating membership growth.
Next to the stage were Sérgio Silva and Ramesh Hanchinal (Synopsys, Inc.), chairs of the M-PHY and UniPro working groups, respectively, who shared an overview of key new features being developed for MIPI M-PHY® v6.0 and MIPI UniPro® v3.0 to support the next version of JEDEC's UFS standard.
Completing the presentation lineup was James Goel (Qualcomm Incorporated), chair of the TSG, with an overview of the MIPI technical roadmap, the latest working group timelines and priorities, and an introduction to the new I/O Bridges Working Group.
The Opening Plenary closed with the recognition of working group participants who contributed to three major specifications released since the last member meeting in September 2024.
For their contributions to the development of MIPI A-PHY® v2.0, MIPI specification awards were presented to A-PHY Working Group co-chairs Edo Cohen (Valens Semiconductor) and Raj Kumar Nagpal (Synopsys, Inc.), vice chair Ariel Lasry (Qualcomm Incorporated), and technical contributors Nadav Banet and Eyran Lida (Valens Semiconductor).
The co-chairs of the MIPI Security Working Group, Philip Hawkes and Rick Wietfeldt (Qualcomm), also accepted specification awards for their leadership in the development of MIPI Camera Security v1.0 and MIPI Camera Security Profiles v1.0. Andrew Elias (NVIDIA) was also recognized for his contributions to the specifications.
In addition to those who received plaques at the Opening Plenary, all working group members who participated in the development of these specifications will receive a certificate.
MIPI’s midweek social event took attendees out to Fenway Park, the country’s oldest major league ballpark, for a casual evening with colleagues. The event included a farewell to Sanjiv Desai, a reception and dinner, and a behind-the-scenes guided tour of one of the city’s most celebrated landmarks.