Justin Endo, chair of the MIPI DevCon Steering Committee, kicks off the day with a welcome to participants and an overview of the agenda for the two-day virtual event.

Presenter:

Justin  Endo, Mixel's marketing manager, oversees marketing strategy and customer engagement from Mixel's headquarters in San Jose, Calif. In this role, he manages Mixel’s exhibition presence at industry events, the development of press releases and white papers, and the promotion of Mixel’s mixed-signal IP portfolio in various industry media. In addition, he serves as chair of the MIPI Alliance DevCon Steering Committee. He holds a bachelor’s degree with a double major in economics and French from the University of California, Los Angeles, and an MBA from The University of Melbourne – Melbourne Business School.

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Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications andresources, education opportunities, outreach and other activities to support the MIPI member ecosystem.

Presenter:

Peter Lefkin has been providing leadership and guidance to the standards development community for more than 20 years. Since 2011, he has served as the managing director of MIPI Alliance, responsible for all MIPI activities and operations, from strategy development to implementation. As MIPI's senior staff executive, he also serves as secretary on the MIPI Alliance Board of Directors.

Peter's background includes previous leadership roles at the American National Standards Institute, Motorola and the IEEE Standards Association. As COO/CFO for IEEE Industry Standards and Technology Organization (IEEE-ISTO), he was instrumental in the formation of multiple standards groups, including the founding of MIPI Alliance in 2003.

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Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.

Presenter:

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This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.

In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embedfunctional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.

Protocol Insight presents useful tools and tips to analyze a UFS trace and the underlying UniPro link layer.

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Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.

Presenters:

Licinio Sousa joined Synopsys in 2009 and is currently a staff product marketing manager responsible for its DesignWare MIPI and mobile storage IP solutions. Licinio brings more than 16 years of experience in semiconductor, IP and EDA companies focusing on software and hardware design. He has also held various R&D, field applications engineering and marketing positions at Synopsys. Licinio holds a bachelor's of science degree from the University of Porto in electrical and computer engineering and a master's degree from the Porto Business School.

Edo Cohen is the co-chair of the MIPI A-PHY Working Group and an active member of the MIPI Technical Steering Group. He has been a member of MIPI Alliance since 2009, contributing in multiple working groups and previously serving as the vice chair and chair for the Display Working Group.

Edo is Valens’ director for strategic innovation, spearheading automotive standardization. He brings more than 20 years of experience as a senior system engineer, with extensive knowledge in system architecture, technical specifications, definition and execution. Prior to Valens, Edo was a senior system architect at Intel Corporation, heading activities in the wearables and IOT group. Previously, he was a senior staff system engineer at Marvell Cellular Division, responsible for the company’s cellular processor environment and held engineering managerial positions at Floware, Alvarion and NAMS. Edo holds an MBA and a bachelor of science in electrical engineering from Tel Aviv University.

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This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.

This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.

Presenter:

Ashraf Takla is president and CEO of Mixel, which he founded in 1998. Before founding Mixel, Ashraf was the director of mixed-signal design at Hitachi Micro Systems. He has 40 years of experience in analog and mixed signal design and holds five patents. Ashraf received his BSEE and MSEE degrees from San Diego State University.

Introspect Technology, producer of innovative test and measurement equipment, demonstrates its latest MIPI D-PHY℠ 3.0 and MIPI C-PHY℠ 2.0 receiver and transmitter test solutions. Building on its award-winning equipment for previous-generation physical layer standards, Introspect Technology shows how easy it is to generate and measure C-PHY patterns at 8 Gsps and D-PHY patterns at 12 Gbps.

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Panel:

Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group Chair
Natsuko Ibuki, Google, LLC
Yuichi Mizutani, Sony Corporation
Wonseok Lee, Samsung Electronics, Co.

Evolution of the MIPI Imaging Conduit

The session begins by exploring the role imaging plays in human vs. machine perception and human/machine interactions, and how MIPI imaging conduits have helped foster advanced vision solutions on multiple platforms. The presentation then covers the features and capabilities of the soon-to-be-released MIPI CSI-2® v4.0.

CSI-2 v4.0 Always-On Sentinel Conduit (AOSC)

The new CSI-2 AOSC feature specifies protocols and commands for streaming real-time image sensor data over the MIPI I3C® bus, especially benefitting always-on imaging applications demanding ultra-low power and low-complexity, PHY-less silicon implementations. The two different AOSC protocol modes, namely the Optimal Transport Mode (OTM) and Smart Transport Mode (STM), are discussed.

CSI-2 v4.0 Multi-Pixel Compression (MPC)

Very high-resolution image sensors with multi-pixel color filter arrays (CFAs) such as Tetra-Cell and Nona-Cell have been developed. The final portion of the presentation focuses on how the new CSI-2 MPC feature helps alleviate the high MIPI bandwidth demands of these sensors by compressing both multi-pixel and standard Bayer CFA images more efficiently and with potentially higher quality than current CSI-2 DPCM methods.

Panelists:

Haran Thanigasalam is an imaging architecture lead (DRI) at Intel, and serves as chair of the MIPI Camera Working Group. He is passionate about advancing imaging and vision solutions on product platforms. Haran grew up in Alberta, Canada, and enjoys spending time in the Canadian Rockies.

Natsuko Ibuki is a silicon engineer at Google specializing in Interface Architecture. She has experience with various interface protocols including CSI-2.

Yuichi Mizutani is an R&D senior manager responsible for the circuit developments, such as high-speed I/F, control I/F like I3C, and low-power digital signal processing, for image sensors for the last 8 years at Sony Semiconductor Solutions Corporation. He holds a master’s degree from Nagoya University in information coding theory.

Wonseok Lee is a senior engineer at Samsung Electronics and has been with the company since 2013. His research interests include image signal processing for sensors and its H/W implementation, with work focused specifically on image compression for imaging sensors.

Justin Endo, chair of the MIPI DevCon Steering Committee, welcomes attendees to the Asia track and provides a brief overview of the sessions on the agenda.

Presenter:

Justin  Endo, Mixel's marketing manager, oversees marketing strategy and customer engagement from Mixel's headquarters in San Jose, Calif. In this role, he manages Mixel’s exhibition presence at industry events, the development of press releases and white papers, and the promotion of Mixel’s mixed-signal IP portfolio in various industry media. In addition, he serves as chair of the MIPI Alliance DevCon Steering Committee. He holds a bachelor’s degree with a double major in economics and French from the University of California, Los Angeles, and an MBA from The University of Melbourne – Melbourne Business School.

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The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.

Presenters:

Azusena Lupercio Ramirez is a signal integrity engineer at Intel Corporation, working on Xeon-based GPIO server solutions. Azusena received a master of engineering at CINVESTAV in the research of low-power/low-voltage and PVT analysis for analog integrated circuits design.

Juan Orozco is a platform architect at Intel Corporation. Juan received his master's of engineering in electronics design at ITESO. Juan joined Intel in 2006 as a hardware designer for Xeon-based systems. He moved in 2016 to the platform architecture division, working as a platform architect for Xeon-E and Xeon-SP platforms.

Nestor Hernandez Cruz is an analog engineer with 10+ years of experience working with signal integrity, with a focus on GPIO signaling and booting interfaces. He has also collaborated in Xeon Phi, and later Xeon server generations, and contributed on the 3Dx point memory projects and their ecosystem. Nestor earned a Ph.D. in electronics and SI design for testability in 2008.

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This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.

This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs

Presenter:

Ashraf Takla is president and CEO of Mixel Inc., which he founded in 1998. Before founding Mixel, Ashraf was the director of mixed-signal design at Hitachi Micro Systems. He has 40 years of experience in analog and mixed signal design and holds five patents. Ashraf received his BSEE and MSEE degrees from San Diego State University.

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Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.

Presenter:

Kelvin Xu is a product marketing manager for Synopsys’ HDMI, mobile storage and MIPI IP solutions. He has more than 14 years of experience in the semiconductor and electronics industries, covering RTL design, FPGA system engineering, silicon validation, IP marketing and business development. Prior to joining Synopsys, Kelvin served as senior technical marketing manager for foundation IP, analog/interface IP and design services at Invecas in APAC. In addition, he has spent more than seven years focusing on HDMI 1.4 to 2.1 products at Silicon Image (now Lattice). Kelvin holds a master's degree in electronics engineering from Wuhan University.

许可先生是新思科技解决方案事业部的资深产品市场经理，负责Synopsys DesignWare HDMI/DP,移动存储和MIPI IP产品线。他在半导体和电子行业拥有超过14年的经验，包括RTL设计、FPGA系统工程、硅验证、IP营销和业务开发。许先生拥有武汉大学EE硕士学位。

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This presentation brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols.

The presentation explains how the latest advancements make it even easier for developers to integrate MIPI A-PHY into automotive E/E architecture, and how the adoption of A-PHY as an IEEE standard expands access in the ecosystem. It also covers how the recently released MIPI Camera and Display Service Extensions (CSE and DSE) and associated Protocol Adaptation Layers (PALs) enable developers to embed functional safety and security functionality natively at the “edge” – within sensor, display and ECU components themselves.

Presenters:

James Goel has a bachelor's of applied science (B.A.Sc) in electrical engineering from the University of Waterloo in Canada and is a licensed professional engineer (P. Eng.) in Ontario, where he has practiced for the last 30 years. James has spent his career developing designs and technical standards for artificial intelligence/machine learning, video, audio and interface solutions in both engineering and management positions. He's been with Qualcomm Technologies Inc. for the last nine years after it acquired his previous company.

Rick Wietfeldt is a senior director, technology, at Qualcomm Technologies Inc. in San Diego. He joined Qualcomm in 2007 and established the Advanced Connectivity Technology office responsible for the standards developments organizations (SDO) that drive mobile interface standards.

He has authored numerous publications and been awarded numerous patents in mobile device architecture and operation. Prior to joining Qualcomm, Rick worked at Texas Instruments in Dallas from 2003-2007 as the OMAP CTO running the U.S. CTO office and helping position OMAP as the workhorse processor of the early smartphone era. Rick received his bachelor of science and master's degrees in electrical engineering from the University of Toronto, and his doctorate from York University in Toronto.

Justin Endo, chair of the MIPI DevCon Steering Committee, welcomes attendees to day two of the virtual event and provide an overview of the agenda.

Presenter:

Justin  Endo, Mixel's marketing manager, oversees marketing strategy and customer engagement from Mixel's headquarters in San Jose, Calif. In this role, he manages Mixel’s exhibition presence at industry events, the development of press releases and white papers, and the promotion of Mixel’s mixed-signal IP portfolio in various industry media. In addition, he serves as chair of the MIPI Alliance DevCon Steering Committee. He holds a bachelor’s degree with a double major in economics and French from the University of California, Los Angeles, and an MBA from The University of Melbourne – Melbourne Business School.

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Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.

Presenters:

Alain Legault is VP IP Products at Hardent where he is responsible for spearheading the product definition and development of its semiconductor IP portfolio. He has more than 25 years of experience managing multidisciplinary engineering projects and developing video-related semiconductor products. He holds a BSEE from the Polytechnique Montréal.

Joe Rodriguez is a product marketing manager with Rambus Controllers. He is an expert at memory IP and MIPI controller IP.

Justin  Endo, Mixel's marketing manager, oversees marketing strategy and customer engagement from Mixel's headquarters in San Jose, Calif. 

In this role, he manages Mixel’s exhibition presence at industry events, the development of press releases and white papers, and the promotion of Mixel’s mixed-signal IP portfolio in various industry media. In addition, he serves as chair of the MIPI Alliance DevCon Steering Committee. He holds a bachelor’s degree with a double major in economics and French from the University of California, Los Angeles, and an MBA from The University of Melbourne – Melbourne Business School.

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The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.

Presenters:

Thomas B. Preußer leads the research team at Accemic Technologies in Dresden, Germany. His research interests include massively parallel compute acceleration and data processing in heterogeneous FPGA-based systems as well as computer arithmetic. He received his Ph.D. in computer engineering from TU Dresden. 

Alexander Weiss studied electrical engineering at the Technical University of Munich and received his Ph.D. in computer science from the Technical University of Dresden. He is co-founder of Accemic Technologies. He holds several patents and has outstanding expertise in the field of safety-critical systems and embedded software testing methods.

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MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks.

This session covers the objectives of the security framework and explains how the framework achieves those objectives.

Presenters:

Philip Hawkes is a principal engineer, technology, at Qualcomm, and is the co-chair of the Security Investigation Group. Phil primarily works on security topics in standards organizations. His experience covers mobile networks, location technologies, IoT/M2M, WiFi and wired connectivity. Phil started his career as a symmetric cryptography expert involved in both design and analysis of algorithms. He received his bachelor of science and doctorate in mathematics from the University of Queensland and is based near Sydney, Australia.

Rick Wietfeldt is a senior director, technology, at Qualcomm in San Diego. He joined Qualcomm in 2007 and established the Advanced Connectivity Technology office responsible for the standards developments organizations (SDO) that drive mobile interface standards.

He has authored numerous publications and been awarded numerous patents in mobile device architecture and operation. Prior to joining Qualcomm, Rick worked at Texas Instruments in Dallas from 2003-2007 as the OMAP CTO running the U.S. CTO office and helping position OMAP as the workhorse processor of the early smartphone era. Rick received his bachelor of science and master's degrees in electrical engineering from the University of Toronto, and his doctorate from York University in Toronto.

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The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.

Presenter:

After earning his degree in computer science from Federico II University in Naples, Giulio Follero joined STMicroelectronics in 2008, where he is a senior quality manager and standardization expert. He has developed his expertise in secure element technology, especially for mobile communication products, and also participates in several standard organizations.

Teledyne LeCroy demonstrates its latest Envision X84 MIPI CSI-2®/MIPI DSI-2℠ protocol Analyzer and Exerciser features, as well as discussing the status of the Eclipse M52 Gear5/UFS4.0 Protocol Analyzer/Exerciser.

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The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.

Presenters:

Azusena Lupercio Ramirez is a signal integrity engineer at Intel Corporation, working on Xeon-based GPIO server solutions. Azusena received a master of engineering at CINVESTAV in the research of low-power/low-voltage and PVT analysis for analog integrated circuits design.

Juan Orozco is a platform architect at Intel Corporation. Juan received his master's of engineering in electronics design at ITESO. Juan joined Intel in 2006 as a hardware designer for Xeon-based systems. He moved in 2016 to the platform architecture division, working as a platform architect for Xeon-E and Xeon-SP platforms.

Nestor Hernandez Cruz is an analog engineer with 10+ years of experience working with signal integrity, with a focus on GPIO signaling and booting interfaces. He has also collaborated in Xeon Phi, and later Xeon server generations, and contributed on the 3Dx point memory projects and their ecosystem. Nestor earned a Ph.D. in electronics and SI design for testability in 2008.

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This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.

Presenters:

Eyuel Zewdu Teferi has been with STMicroelectronics since 2016 and is currently a senior hardware design engineer in analog and MEMS group in the MEMS sensor division. He has worked on projects designing and implementing interface designs for MEMS sensors. He earned his master's degree in electronics engineering in Politecnico di Torino, focusing on embedded systems. He is involved in both MIPI and JEDEC, is an active member of the MIPI I3C working Group and is currently the vice chair of the MIPI I3C Basic Ad-hoc Working Group.

David Schumacher has been with STMicroelectronics since 2020 and is currently a senior application & validation engineer for photonic sensors in the imaging division. Before joining STMicroelectronics, he was involved on software and system projects for a large scope of role and field applications. He is involved in the AFIS organization as an agile model-based system engineering expert.

Souha Koukijoined STMicroelectronics in 2021 as interface validation engineer for photonic sensors in the imaging division. She earned her master's degree in real time system engineering at Paul Sabatier Toulouse III University.

MIPI Debug for I3C℠ is a minimal-pin interface for transporting debug controls and data between a debug and test system (DTS) and a target system (TS). The Silvaco I3C board, using two I3C CCC (common command codes ) – DBGACTION and DBGOPCODE, demonstrates tracing and capturing of data from the target DTS.

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Panel:

Tim McKee, Intel Corporation, MIPI I3C Working Group Chair
Matthew Schnoor, Intel Corporation
Eyuel Zewdu Teferi, STMicroelectronics, MIPI I3C Basic Ad-hoc Working Group Vice Chair
Radu Pitigoi-Aron, Qualcomm Technologies Inc.
Ian Smith, MIPI Alliance

This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.

Topics include:

• What’s new in MIPI I3C v1.1.1, MIPI I3C Basic℠ v1.1 and MIPI I3C HCI℠
• Key features that are broadening the reach and use of MIPI I3C usage within other standards organizations
• How to achieve I3C conformance in the current absence of in-person plug fests
• How to get involved in the MIPI I3C Working Group

Panelists:

Tim McKee, a system architect from Intel Corporation, works to create and enable standards for industry advancement. Over the last year, he has worked as the MIPI I3C Working Group vice chair to drive I3C technology forward through the development of MIPI I3C v1.1 and MIPI I3C Basic v1.1 documents (specifications, FAQ, App Notes, CTS, etc.) Tim also helped lead the liaison activities with I3C/JEDEC to create the JESD403 Sideband Bus specification. Tim has already taken a leadership role with multiple I3C projects, including the development of a new specification framework and MCTP over I3C subgroup.

Since the beginning of his career, Tim has worked with many standards bodies, including USB-IF, PCI-SIG, CXL Consortium, and of course MIPI Alliance. Through his work he has held multiple positions, including USB Power Delivery Compliance chairman and various vice chair and contributor positions. Tim holds a bachelor of science degree in electrical and computer engineering from Oregon State University.

Matthew Schnoor is a debug architect at Intel and member of the MIPI Debug Working Group. Matthew has more than two decades of experience in various Intel business groups, primarily focused on software development, silicon validation and system debug architecture. He has enabled MIPI I3C to support MIPI Debug for I3C, and currently works across and within several MIPI working groups to help develop MIPI specifications in support of that goal.

Eyuel Zewdu Teferi has been with STMicroelectronics since 2016 and is currently a senior hardware design engineer in analog and MEMS group in the MEMS sensor division. He has worked on projects designing and implementing interface designs for MEMS sensors. He earned his master's degree in electronics engineering in Politecnico di Torino, focusing on embedded systems. He is involved in both MIPI and JEDEC, is an active member of the MIPI I3C working Group and is currently the vice chair of the MIPI I3C Basic Ad-hoc Working Group.

Radu Pitigoi-Aron is a principal engineer at Qualcomm Technologies, Inc. He has a MSEE Degree from POLITEHNICA University of Bucharest and has worked as design project lead in Romania, South Africa and the United States. Radu is among the initial developers of the I3C Interface and his current technical interests are on electronics system design, complex applications, and wired interfaces in the range up to 100Mbps. His focus is on increasing the system performance while drastically reducing the energy expenditure.

Based in the UK, Ian Smith presently works as an independent consultant specializing in the Internet of Things, mobile telecommunications and cyber-security. Working at the forefront of mobile technology for over 20 years, Ian has helped numerous global organizations achieve major technology firsts. This includes helping the GSMA develop the first globally recognized set of IoT security guidelines and leading the GSMA’s development of the first standardized Embedded SIM (eSIM) for IoT services. He has also held leading roles within network operators, including Hutchison (Three UK) and Orange, driving the launch of the world’s first 2.5G, 3G and 4G handsets and services. Most recently Ian has been working with MIPI Alliance to deliver an IoT white paper that outlines how MIPI’s specifications help developers achieve key IoT device design goals such as low power consumption, low cost/complexity and long lifecycles. Ian holds a B.Eng. in electronic engineering and computer science from Aston University, UK.