12 February 2020, 08:00-09:00 PST
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Beyond Sensors: What's New in MIPI I3C v1.1
Learn about the many new features and capabilities enabled by MIPI I3C® v1.1, the first update to the ground-breaking I3C bus interface designed to eliminate the historical pain points of I2C development. With a significant speed increase and a host of new features that enhance reliability, I3C v1.1 not only strengthens the upgrade path for I2C implementers, but also enables even broader use cases in markets across mobile, IoT, industrial, automotive, data centers, PC clients, drones and more.
In this webinar, Ken will present an environmental scan of the current I3C ecosystem, followed by an in-depth look at the new features in the latest version. He’ll also compare v1.1’s feature set with those of I3C v1.0 and I3C Basic v1.0 to help implementers choose the specification that best meets their needs. In addition, Ken will share the I3C Working Group’s plans for future development and provide a preview of related development efforts currently underway.
Ken Foust is a principal engineer at Intel Corporation, where he leads wired/wireless interconnect and sensing R&D initiatives within Intel Labs. In this capacity, he also works closely with standards bodies such as MIPI, for which he serves as the chair of the I3C Working Group. Ken has been recognized with the MIPI Alliance Distinguished Service Award and as a Sensors Expo Engineer of the Year, and he is a member of the MSIG Technical Advisory Committee and Hall of Fame. Before joining Intel, Ken held many positions, including director of product engineering at Kionix, Inc., in Ithaca, N.Y. He started his career as a product engineer at IBM Microelectronics in Essex Junction, Vt. Ken holds a B.S. degree in electrical engineering from Alfred University.