Tuesday, April 11, 2017

11 April 2017, 08:00-09:00 PST


Latest installment of MIPI CSI-2 v2.0 over C-PHY v1.2 & D-PHY v2.1 imaging conduit delivers number of key features and capabilities for Mobile and beyond Mobile platforms including:

  • BW gains for performance image sensors  
  • Latency Reduction and Transport Efficiency for time sensitive applications
  • Provisions to alleviate electrical overstress
  • Enhanced High Dynamic Range
  • Updated Differential Pulse Code Modulation
  • Extended Virtual Channels mapped to Multi-Exposure / Multi-Sensor topologies
  • Provision to reduce Power Spectral Density emissions

Speaker Bio:

Haran Thanigasalam is a distinguished Senior Platform Architect at Intel leading key areas of imaging conduit development for products across multiple Business Units. He has 15 years of experience developing solutions for various technologies such as Networking, Storage, Graphics, and Imaging. Haran is also chairing MIPI Camera Working Group developing imaging solutions for Wearables, Mobile, IoT, Drones, and Automotive applications. He grew up in Alberta and very much enjoys spending time amidst the Canadian Rockies.

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