MIPI SLIMbus®
Audio
Developed by: Audio Working Group
An interface transporting audio for components in mobile and mobile-influenced designs
Quick Facts
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Fundamental Features
- High performance
- Low power
- Low EMI
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Use Cases
- Multichannel high-quality audio streams
- Phase coherence for stereophonic sound
- Microphone arrays
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Advantages
Used in smartphones to interface larger-sized audio components
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Physical Layer
CMOS I/Os
Get the Specification
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Current Version
MIPI SLIMbus® v2.0 (Nov 2015)
Member version -
Previous Versions
All SLIMbus versions are available to MIPI members on the member website (Causeway).
Overview
General Info
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Overview
MIPI SLIMbus®, introduced by MIPI Alliance in 2007, is used in hundreds of millions of mobile terminals. The specification supports a wide range of digital audio and control solutions to seamlessly transport audio and related data for larger-sized mobile device components such as the application processor, audio codec, modem, audio digital signal processor, Bluetooth chipset and FM receiver. Multiple components can be interconnected on the same link to lower overall system costs and facilitate flexible designs.
MIPI SLIMbus is developed by the Audio Working Group.
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Key Features
The specification’s key features include a single data rate, fixed frame size, clock handover capabilities for low-power operation in certain use cases, unified messages, and device-to-device communications.
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Latest Release
The most recent update, MIPI SLIMbus v2.0, released in November 2015, can scale bandwidth via reduced number of ports to simplify integration and minimize board space. It supports multichannel high-quality audio streams, phase coherence to enable stereophonic sound, microphone arrays and other compelling features. It can coexist with MIPI SoundWire or non-MIPI Alliance interfaces through bridging solutions.
Note: The full specification is available only to MIPI Alliance members. For information about joining MIPI Alliance, visit Join MIPI.