Christina Slape, MIPI Senior Communications Manager
Webinar rescheduled: Due to technical issues with our web conferencing platform, this webinar was recheduled from 4 March to 11 March at 8:30 am PDT. Register »
Join MIPI Automotive Working Group chair Matt Ronning (Sony Corporation) and PHY Working Group vice chair and A-PHY Subgroup lead Raj Kumar Nagpal (Synopsys, Inc.) at 8:30 a.m. PDT on Wednesday, 11 March, for an in-depth look at the forthcoming MIPI A-PHY℠.
"Advancing In-Vehicle Connectivity for ADAS and Other Automotive Applications," will include an overview of the factors driving A-PHY development, as well as the specification's structure, topologies, key features and fit with other wired connectivity technologies. Also included will be a discussion of how the specification can be leveraged in the near term as well as in the future.
MIPI A-PHY is a high-speed, “long-reach“ (up to 15m) physical layer specification that will allow native connections to the widely implemented CSI-2℠ and DSI-2℠ protocols. The goal is to provide the automotive industry with a standardized approach that offers both high performance and simplified integration, along with the flexibility needed to suit a broad range of speed and design needs. An advanced draft is already available to Contributor members, and MIPI A-PHY v1.0 is expected to be adopted mid-year.
Presenters
Matt Ronning is director of engineering at Sony Corporation and serves as chair for the MIPI Automotive Working Group. Matt is making significant steps leading the group that provides input and coordination on requirements to ensure MIPI is addressing the needs of the automotive industry.
Raj Kumar Nagpal is senior manager at Synopsys, Inc. and serves as vice chair of the MIPI PHY Working Group, and lead of the A-PHY and D-PHY subgroups. Raj has more than 25 years of research and development experience in various fields of electronics, including RF engineering, high-speed serial links, signal integrity, power integrity and product validation. His work at Synopsys focuses on high-speed serial links architecture/system-level modeling, as well as signal integrity and power integrity domains of high-speed serial links.
2020 Archived Webinars
You can still take advantage of MIPI education even if you missed the live events. The presentations and recordings of the January webinar on CSI-2 and the recent I3C webinar are available on the MIPI website.
- "The New Frontier of MIPI CSI-2℠ Camera and Imaging Applications: Leveraging the Power of Machine Vision for Mobile, IoT, Client Devices, Automotive and Beyond" explored the evolution of the MIPI CSI-2 imaging conduit and the latest versions of the specification. Haran Thanigasalam (Intel Corporation), MIPI Camera Working Group chair, discussed the features and capabilities enabled by CSI-2 v3.0 and those under development for CSI-2 v4.0, targeted for release later this year.
- In "Beyond Sensors: What's New in MIPI I3C v.1.1," Working Group Chair Ken Foust (Intel Corporation) provided an overview of the new features in MIPI I3C® v1.1, comparing them with those of MIPI I3C v1.0 and I3C Basic℠ v1.0 to help implementers choose the specification that best meets their needs. He also shared the working group's plans for future development and provided a preview of related development efforts currently underway.