Moving Mobile Forward
Interface specifications for mobile, automotive, IoT and more
CSI-2®
MIPI Camera Serial Interface 2
A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors
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DSI-2™
MIPI Display Serial Interface 2
A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays
I3C®
MIPI Improved Inter Integrated Circuit
A scalable utility and control bus interface for connecting peripherals to an application processor
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C-PHY™
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays
D-PHY™
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays
A-PHY®
Physical Layer
Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications
SWI3S®
MIPI SoundWire I3S
A scalable, low-power, and noise-resilient embedded audio interface for all device form factors, large and small
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RFFE™
MIPI RF Front-End Control Interface
A control interface that simplifies integration of complex RF front-end devices
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See all MIPI Alliance specifications
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