A family of high speed physical layers to serve essential interconnection needs in a device
The physical layer, or PHY, is the heart of any interconnection solution. MIPI Alliance offers a family of three high-performance and cost-optimized physical layers: MIPI D-PHY, MIPI M-PHY and MIPI C-PHY. Companies can apply the specifications to support a variety of protocol layers and applications for smartphones and mobile-connected devices such as tablets, laptops, automobiles, robotics systems, wearables and other endpoints on the Internet of Things.
MIPI D-PHY is used primarily to interconnect cameras and displays to an application processor. MIPI M-PHY supports multimedia and chip-to-chip/interprocessor communications. MIPI C-PHY supports cameras and displays. Each PHY meets very rigorous requirements for high performance, low-power operation and low electromagnetic interference (EMI) interfaces.
For a side-by-side comparison of the PHY operational and performance characteristics, please refer to the Specification Brief.